Technology Development
產能 Production Capacity
A-LINE
B-LINE
製程能力 Process Capability| (Unit: mm) | Dimension |
| Substrate Size (Max.) | 510 x 460 |
| Substrate Size (Min.) | 80 x 50 |
| Substrate Thickness | 0.5 ~ 6.0 |
| Comp. size (Min.) | 0.4 x 0.2 (01005 = 0.016" × 0.008" |
| IC Pitch (Min.) | 0.3 |
| BGA Pitch (Min.) | 0.3 |
| Solder Paste Printer | 0.20 |
| Mounter Precision | ±0.03 / CHIP |
| Comp. Pitch (Min.) | 4mil (0.10㎜) |
| BGA Ball (Min.) | 0.15 |
| IC Pin (Min.) | 0.20 |
| POP Mfg. Capability | POP*3F |
生產設備 Process Machine| 設備名稱 Equipments | 數量 Q'ty | 廠牌 Brand | |
| 錫膏印刷機 | Solder Paste Printer | 2 | EARK X5 *2 |
| 錫膏測厚機 | Solder paste measurement | 1 | ASM-III |
| 高速打件機 | Chip Mounter | 4 | YAMAHA YS12*4 |
| 泛用打件機 | Universal Mounter | 2 | YAMAHA YS88*1 YS12F*1 |
| 迴焊爐 | IR Reflow Oven | 2 | Folungwin RX-860N *1 ERSA 320N*1 |
| DIP波焊爐 | Wave Soldering | 1 | 吉電 620L |
| 測溫機 | Profile Checker | 2 | data paq & KIC-2000 |
| BGA置件機 | BGA Rework M/C | 1 | ERSA IR550 |
| 低溫防潮箱 | Low Temp. Container | 1 | 高強 T40-315 |
| 自動光學檢驗機 | A.O.I. | 1 | TR7700 SIII |
| 氮氣產生機 | N2 | 1 | 東宇電機 |
| 2.5D X光檢測儀 | 2.5D X-Ray | 1 | Dage XD7500VR |
| IC燒錄機 | IC Programmer | 2 | Leap SU-600*2 |
