製程能力
| (Unit: mm) | Dimension |
| Substrate Size (Max.) | 510 x 460 |
| Substrate Size (Min.) | 80 x 50 |
| Substrate Thickness | 0.5 ~ 6.0 |
| Comp. size (Min.) | 01005 = 0.016" × 0.008" (0.4 x 0.2 mm) |
| IC Pitch (Min.) | 0.3 |
| BGA Pitch (Min.) | 0.3 |
| Solder Paste Printer | 0.20 |
| Mounter Precision | ±0.03 / CHIP |
| Comp. Pitch (Min.) | 4mil (0.10㎜) |
| BGA Ball (Min.) | 0.15 |
| IC Pin (Min.) | 0.20 |
| POP Mfg. Capability | POP*3F |
●POP製程生產分解動作
