Cabability
| Standard | Advanced | Remarks | |
| SIZES | |||
| Maximum finished board size(inch) |
20”*22” | 20”*24” | |
| Standard finished board size(inch) |
10”*16” | 18”*20” | |
| Maximum working panel size(inch) |
20”*24” | 22”*26” | |
| THICKNESS | |||
| Maximum finished thickness |
5.0 mm | 10.0 mm | |
| Maximum finished thickness(2-side) |
0.3 mm | 0.2 mm | |
| Minimum finished thickness(4-layer) |
0.4 mm | 0.35 mm | |
| Board thickness tolerance |
±10% | ±8% | |
| Warpage /bow and twist-inch per inch |
0.7% | 0.5% | |
| LAYER CONSTRUCTION | |||
| Maximum processed layer count |
32L | 40L | |
| Standard processed layer count |
2L~16L | 18L~40L | |
| Maximum copper foil (inner layer) |
3 oz | 6 oz | |
| Maximum copper foil (outer layer) |
3 oz | 5 oz | |
| Minimum core thickness | 0.075 mm | 0.05 mm | |
| Layer to layer registration |
0.075 mm | 0.075 mm | |
| Dielectric tolerance layer to layer |
±10% | ±10% | |
| ASPECT RATIO | |||
| Maximum aspect ratio- plated through holes | 20:1 | 32:1 | |
| Maximum aspect ratio- micro via holes |
0.8:1 | 1:1 | |
| Maximum aspect ratio- buried via holes |
10:1 | 20:1 | |
| MECHANICALLY DRILLED HOLE SIZES | |||
| Minimum drill size versus thickness 1.2mm prior to plating |
0.15 mm | 0.10 mm | |
| Minimum drill size versus thickness 3.2mm prior to plating |
0.20 mm | 0.15 mm | |
| Minimum drill size versus 4.2mm prior to plating |
0.25 mm | 0.20 mm | |
| Minimum drill size mechanically drilled holes prior to plating |
0.15 mm | 0.10 mm | |
| Smallest finished PTH | 0.15 mm | 0.10 mm | |
| Max. finished PTH | 6.0 mm | 6.2 mm | |
| Maximum hole diameter which can be plugged |
0.5 mm | 0.60 mm | |
| HOLE SIZE TOLERANCE | |||
| PTH standard | ± 0.003'' / 0.075 mm | ± 0.002'' / 0.050 mm | |
| NPTH | ± 0.002'' / 0.050 mm | ± 0.002'' / 0.050 mm | |
| True position tolerance | ± 0.003'' / 0.075 mm | ± 0.003'' / 0.075 mm | |
| CONDUCTOR WIDTH | |||
| Minimum trace width inner layer |
0.003'' / 0.075 mm | 0.0023'' / 0.060 mm | For H oz |
| Typical trace width inner layer |
0.003'' / 0.075 mm | 0.003'' / 0.075 mm | For 1 & H oz |
| Minimum trace width outer layer |
0.003'' / 0.075 mm | 0.0023'' / 0.060 mm | For 1 & H oz |
| Typical trace width outer layer |
0.004'' / 0.100 mm | 0.003'' / 0.075 mm | For 1 & H oz |
| Etch tolerance 1/2 oz Cu | ± 20% | ± 20% | |
| Etch tolerance 1 oz Cu | ± 20% | ± 20% | |
| Etch tolerance 2 oz Cu | ± 20% | ± 20% | |
| CONDUCTOR SPACE | |||
| Minimum space copper to copper inner layer |
0.003'' / 0.075 mm | 0.0023'' / 0.060 mm | For H oz |
| Typical space copper to copper inner layer |
0.004'' / 0.100 mm |
0.003'' / 0.075 mm |
For H oz |
| Minimum space copper to copper outer layer |
0.003'' / 0.075 mm | 0.0023'' / 0.060 mm | For H oz |
| Typical space copper to copper outer layer |
0.004'' / 0.100 mm |
0.003'' / 0.075 mm | For H oz |
| Minimum space drill to copper |
0.010'' / 0.250 mm | 0.008'' / 0.200 mm | For class 2 |
| Minimum annular ring inner layer |
0.005'' / 0.125 mm | 0.004'' / 0.100 mm | For class 2 |
| Typical annular ring inner layer |
0.006'' / 0.150 mm | 0.006'' / 0.150 mm | For class 3 |
| Minimum annular ring outer layer |
0.005'' / 0.125 mm |
0.004'' / 0.100 mm |
For class 2 |
| Typical annular ring outer layer |
0.006'' / 0.150 mm | 0.006'' / 0.150 mm | For class 3 |
| Minimum SMD land Pattern Pitch |
0.014'' / 0.35 mm | 0.012'' / 0.30 mm | |
| Minimum plane clearance inner layer |
0.010'' / 0.25 mm | 0.008'' / 0.20 mm | |
| Minimum plane clearance outer layer |
0.006'' / 0.150 mm | 0.004'' / 0.100 mm | |
| CONDUCTOR IMPEDANCE | |||
| Impedance typical- value ohms |
100/50 |
100/50 |
|
| Impedance typical- tolerance |
± 10% | ± 8% | |
| Impedance measurement technique (equipment/type) |
Tek DSA8200 / Polar cits500 |
Tek DSA8200 / Polar cits500 |
|
| Differential impedance measurement equipment |
Tek DSA8200 / Polar cits500 |
Tek DSA8200 / Polar cits500 |
|
| Back Drill | |||
| Back Drill tolerance | L +/- 0.1mm | L +/- 0.075mm | |
| Back Drill size | Drill bit + 0.15mm | Drill bit + 0.15mm | |
| Smallest Drill | 0.20 mm | 0.15 mm | |
| Smallest Back Drill size | 0.35 mm | 0.3 mm | |
| Cavity | |||
| Cavity Depth control | +/- 0.1 mm | +/- 0.1 mm | |
| Resin Flow | <250um | <250um | |
| Coin | |||
| Flateness on top side | 25 um | 15 um | |
| Coin type | I coin | HDI + I coin ,U coin | |
| LAMINATE MATERIALS | |||
| FR4 laminate thickness (standard) |
1.6 mm | 1.6 mm | |
| High Tg FR4 (170 deg C) | Yes | Yes | |
| Polyimide | Yes | Yes | |
| PTFE Teflon | Yes | Yes | |
| Rogers RO4000 3000 5000 6000 series |
Yes | Yes | |
| Rogers RO4000 3000 series (Mixed dieletrics) |
Rogers / FR4 | Rogers / FR4 | |
| Metal core | Copper/ Aluminum Base |
Copper/ Aluminum Base |
|
| OTHER TECHNOLOGIES | |||
| Buried vias- conventional |
Yes | Yes | |
| Blind vias - conventional | Yes | Yes | |
| Blind micro vias | Yes | Yes | |
| How many sequential layers of microvias (one side) |
3 | 4 | |
| Via in pad | Yes | Yes | |
| Via on pad | Yes | Yes | |
| Non-conductive via fill | Yes | Yes | |
| Conductive copper paste via fill |
Yes | Yes | |
| Flexible circuits | N /A | N /A | |
| Rigid - flex circuits | N /A | N /A | |
| SOLDER MASK AND LEGEND | |||
| Nominal solder mask thickness |
0.4 mil | 0.8 mil | |
| Solder mask type | Liquid Photoimageable | Liquid Photoimageable | |
| Minimum solder mask clearance |
0.0025'' | 0.002'' | |
| SURFACE FINISHES | |||
| HASL (leaded and lead- free) |
Yes | Yes | 100 u" ~ 1000 u" |
| Electrolytic NI/Gold | Yes | Yes | Max. 50 u" |
| Electroless Ni/ Immersion Gold |
Yes | Yes | 1 ~ 5 u" Au |
| ENTEK OSP SHIKOKU F2 (LX)) |
Yes | Yes | 8 ~ 20 u" |
| Soft Gold | Yes | Yes | Min. 10 u" |
| Selective Hard Gold plating (with HASL or immersion gold) |
Yes | Yes | Max. 50 u" |
| Immersion Silver | Yes | Yes | 4 ~ 12 u" |
| Immersion Tin | Yes | Yes | Min. 30 u" |
| ELECTRICAL TEST | |||
| Net list extraction | Yes | Yes | |
| Net list comparison | Yes | Yes | |
| Simultaneous top and bottom 100% net list |
Yes | Yes | |
| Continuity | Yes | Yes | |
| Isolation | Yes | Yes | |
| Impedance test coupon | Yes | Yes | |
| ARTWORK FORMAT | |||
| Artwork format | 274X | ||
| Photo plot | Yes | ||