SMT Capability
(Unit: mm) | Dimension |
Substrate Size (Max.) | 510 x 460 |
Substrate Size (Min.) | 80 x 50 |
Substrate Thickness | 0.5 ~ 6.0 |
Comp. size (Min.) | 01005 = 0.016" × 0.008" (0.4 x 0.2 mm) |
IC Pitch (Min.) | 0.3 |
BGA Pitch (Min.) | 0.3 |
Solder Paste Printer | 0.20 |
Mounter Precision | ±0.03 / CHIP |
Comp. Pitch (Min.) | 4mil (0.10㎜) |
BGA Ball (Min.) | 0.15 |
IC Pin (Min.) | 0.20 |
POP Mfg. Capability | POP*3F |
●POP Mfg. Process