製程能力
| 類別 | Standard (標準) |
Advanced (高階) |
Remarks |
| SIZES (尺寸) | |||
| Maximum finished board size(inch) (最大成品尺寸) |
20”*22” | 20”*24” | |
| Standard finished board size(inch) (標準成品尺寸) |
10”*16” | 18”*20” | |
| Maximum working panel size(inch) (最小工作尺寸) |
20”*24” | 22”*26” | |
| THICKNESS (厚度) | |||
| Maximum finished thickness (最大成品板厚) |
5.0 mm | 10.0 mm | |
| Maximum finished thickness(2-side) (最小成品板厚) |
0.3 mm | 0.2 mm | |
| Minimum finished thickness(4-layer) (最小成品板厚) |
0.4 mm | 0.35 mm | |
| Board thickness tolerance (成品板厚公差) |
±10% | ±8% | |
| Warpage /bow and twist-inch per inch (板彎翹規格) |
0.7% | 0.5% | |
| LAYER CONSTRUCTION (層數結構) | |||
| Maximum processed layer count (最大生產層數) |
32L | 40L | |
| Standard processed layer count (標準生產層數) |
2L~16L | 18L~40L | |
| Maximum copper foil (inner layer) (內層銅箔) |
3 oz | 6 oz | |
| Maximum copper foil (outer layer) (外層銅箔) |
3 oz | 5 oz | |
| Minimum core thickness (最小基板厚度) |
0.075 mm | 0.05 mm | |
| Layer to layer registration (層間對準度) |
0.075 mm | 0.075 mm | |
| Dielectric tolerance layer to layer (層間絕緣層公差) |
±10% | ±10% | |
| ASPECT RATIO (電鍍縱橫比) | |||
| Maximum aspect ratio- plated through holes (最大貫穿孔縱橫比) |
20:1 | 32:1 | |
| Maximum aspect ratio- micro via holes (最大雷射孔縱橫比) |
0.8:1 | 1:1 | |
| Maximum aspect ratio- buried via holes (最大埋孔縱橫比) |
10:1 | 20:1 | |
| MECHANICALLY DRILLED HOLE SIZES (機械鑽孔孔徑) | |||
| Minimum drill size versus thickness 1.2mm prior to plating (鍍銅前板厚1.2mm 的最小鑽徑) |
0.15 mm | 0.10 mm | |
| Minimum drill size versus thickness 3.2mm prior to plating (鍍銅前板厚3.2mm 的最小鑽徑) |
0.20 mm | 0.15 mm | |
| Minimum drill size versus 4.2mm prior to plating (鍍銅前板厚4.2mm 的最小鑽徑) |
0.25 mm | 0.20 mm | |
| Minimum drill size mechanically drilled holes prior to plating (鍍銅前最小機械鑽孔孔徑) |
0.15 mm | 0.10 mm | |
| Smallest finished PTH (最小成品孔徑) |
0.15 mm | 0.10 mm | |
| Max. finished PTH (最大成品孔徑) |
6.0 mm | 6.2 mm | |
| Maximum hole diameter which can be plugged (最大塞孔孔徑) |
0.5 mm | 0.60 mm | |
| HOLE SIZE TOLERANCE (孔徑公差) | |||
| PTH standard (PTH孔標準) |
± 0.003'' / 0.075 mm | ± 0.002'' / 0.050 mm | |
| NPTH (NPTH孔) |
± 0.002'' / 0.050 mm | ± 0.002'' / 0.050 mm | |
| True position tolerance(精確度) |
± 0.003'' / 0.075 mm | ± 0.003'' / 0.075 mm | |
| CONDUCTOR WIDTH (線寬) | |||
| Minimum trace width inner layer (最小內層線寬) |
0.003'' / 0.075 mm | 0.0023'' / 0.060 mm | For H oz |
| Typical trace width inner layer (典型的內層線寬) |
0.003'' / 0.075 mm | 0.003'' / 0.075 mm | For 1 & H oz |
| Minimum trace width outer layer (最小外層線寬) |
0.003'' / 0.075 mm | 0.0023'' / 0.060 mm | For 1 & H oz |
|
Typical trace width
outer layer (典型的外層線寬)
|
0.004'' / 0.100 mm | 0.003'' / 0.075 mm | For 1 & H oz |
| Etch tolerance 1/2 oz Cu (1/2 oz Cu蝕刻公差) |
± 20% | ± 20% | |
| Etch tolerance 1 oz Cu (1 oz Cu蝕刻公差) |
± 20% | ± 20% | |
| Etch tolerance 2 oz Cu (2 oz Cu蝕刻公差) |
± 20% | ± 20% | |
| CONDUCTOR SPACE(線距) | |||
| Minimum space copper to copper inner layer (最小內層銅到銅線距) |
0.003'' / 0.075 mm | 0.0023'' / 0.060 mm | For H oz |
| Typical space copper to copper inner layer (典型的內層銅到銅線距) |
0.004'' / 0.100 mm |
0.003'' / 0.075 mm |
For H oz |
| Minimum space copper to copper outer layer (最小外層銅到銅線距) |
0.003'' / 0.075 mm | 0.0023'' / 0.060 mm | For H oz |
| Typical space copper to copper outer layer (典型的外層銅到銅線距) |
0.004'' / 0.100 mm | 0.003'' / 0.075 mm | For H oz |
| Minimum space drill to copper (最小孔邊到銅線距) |
0.010'' / 0.250 mm | 0.008'' / 0.200 mm | For class 2 |
| Minimum annular ring inner layer (最小內層孔環) |
0.005'' / 0.125 mm | 0.004'' / 0.100 mm | For class 2 |
| Typical annular ring inner layer (典型的內層孔環) |
0.006'' / 0.150 mm | 0.006'' / 0.150 mm | For class 3 |
| Minimum annular ring outer layer (最小外層孔環) |
0.005'' / 0.125 mm | 0.004'' / 0.100 mm | For class 2 |
| Typical annular ring outer layer (典型的外層孔環) |
0.006'' / 0.150 mm | 0.006'' / 0.150 mm | For class 3 |
| Minimum SMD land Pattern Pitch (最小SMD Pad 中心到中 心距離) |
0.014'' / 0.35 mm | 0.012'' / 0.30 mm | |
| Minimum plane clearance inner layer (最小內層隔離孔環) |
0.010'' / 0.25 mm | 0.008'' / 0.20 mm | |
| Minimum plane clearance outer layer (最小外層隔離孔環) |
0.006'' / 0.150 mm | 0.004'' / 0.100 mm | |
| CONDUCTOR IMPEDANCE(阻抗控制) | |||
| Impedance typical-value ohms(典型的阻抗值) |
100/50 |
100/50
|
|
| Impedance typical- tolerance (典型的阻抗公差) |
± 10% | ± 8% | |
| Impedance measurement technique (equipment/type) (阻抗量測設備型號) |
Tek DSA8200 / Polar cits500 |
Tek DSA8200 / Polar cits500 |
|
| Differential impedance measurement equipment (差動阻抗量測設備) |
Tek DSA8200 / Polar cits500 |
Tek DSA8200 / Polar cits500 |
|
| Back Drill(背鑽) | |||
| Back Drill tolerance (背鑽公差) |
L +/- 0.1mm | L +/- 0.075mm | |
| Back Drill size (背鑽尺寸) |
Drill bit + 0.15mm | Drill bit + 0.15mm | |
| Smallest Drill (最小孔徑) |
0.20 mm | 0.15 mm | |
| Smallest Back Drill size (背鑽最小孔徑) |
0.35 mm | 0.3 mm | |
| Cavity(開槽設計) | |||
| Cavity Depth control (開槽深度控制) |
+/- 0.1 mm | +/- 0.1 mm | |
| Resin Flow (樹脂流動) |
<250um | <250um | |
| Coin(銅塊) | |||
| Flateness on top side (頂部平整度) |
25 um | 15 um | |
| Coin type (銅塊類型) |
I coin | HDI + I coin ,U coin | |
| LAMINATE MATERIALS (材料種類) | |||
| FR4 laminate thickness (standard) (FR4標準的基板厚度) |
1.6 mm | 1.6 mm | |
| High Tg FR4 (170 deg C) (Tg 170℃ FR4材料) |
Yes | Yes | |
| Polyimide | Yes | Yes | |
| PTFE Teflon (鐵弗龍材料) |
Yes | Yes | |
| Rogers RO4000 3000 5000 6000 series |
Yes | Yes | |
| Rogers RO4000 3000 series (Mixed dieletrics) |
Rogers / FR4 | Rogers / FR4 | |
| Metal core (金屬基板) |
Copper/ Aluminum Base |
Copper/ Aluminum Base |
|
| OTHER TECHNOLOGIES (其他技術) | |||
| Buried vias- conventional(機械埋孔) |
Yes | Yes | |
| Blind vias - conventional (機械盲孔) |
Yes | Yes | |
| Blind micro vias (雷射盲孔) |
Yes | Yes | |
| How many sequential layers of microvias (one side) (單面微盲孔疊孔層數) |
3 | 4 | |
| Via in pad(VIP設計) | Yes | Yes | |
| Via on pad(VOP設計) | Yes | Yes | |
| Non-conductive via fill (孔內非導電填孔) |
Yes | Yes | |
| Conductive copper paste via fill (孔內導電填孔) |
Yes | Yes | |
| Flexible circuits(軟板) | N /A | N /A | |
| Rigid - flex circuits (軟硬結合板) |
N /A | N /A | |
| SOLDER MASK AND LEGEND (防焊) | |||
| Nominal solder mask thickness (標準防焊厚度) |
0.4 mil | 0.8 mil | |
| Solder mask type (防焊種類) |
Liquid Photoimageable | Liquid Photoimageable | |
| Minimum solder mask clearance (最小防焊隔離環) |
0.0025'' | 0.002'' | |
| SURFACE FINISHES (表面處理 ) | |||
| HASL (leaded and lead-free) (有鉛與無鉛噴錫) |
Yes | Yes | 100 u" ~ 1000 u" |
| Electrolytic NI/Gold (電鍍鎳金) |
Yes | Yes | Max. 50 u" |
| Electroless Ni/ Immersion Gold (化學鎳金) |
Yes | Yes | 1 ~ 5 u" Au |
| ENTEK OSP ( SHIKOKU F2 (LX)) (有機保焊) |
Yes | Yes | 8 ~ 20 u" |
| Soft Gold (軟金) | Yes | Yes | Min. 10 u" |
| Selective Hard Gold plating(選擇性鍍金) (with HASL or immersion gold) (與噴錫或化金) |
Yes | Yes | Max. 50 u" |
| Immersion Silver (化學銀) |
Yes | Yes | 4 ~ 12 u" |
| Immersion Tin (化學錫) |
Yes | Yes | Min. 30 u" |
| ELECTRICAL TEST (測試) | |||
| Net list extraction (Net list取出) |
Yes | Yes | |
| Net list comparison (Net list比對) |
Yes | Yes | |
| Simultaneous top and bottom 100% net list (同時100%雙面測) |
Yes | Yes | |
| Continuity (通路) | Yes | Yes | |
| Isolation (斷路) | Yes | Yes | |
| Impedance test coupon (阻抗條測試) |
Yes | Yes | |
| ARTWORK FORMAT | |||
| Artwork format | 274X | ||
| Photo plot | Yes | ||