Computer Related Products

Technologies

• Any layer HDI
• Aspect ratio up to 25
• Back drill
• Board thickness range from 10 to 390 mil (0.25 to 9 mm)
• High speed and low loss materials
• Layer count up to 40
• Micro via Cu fill plate
• Minimum line width / spacing 2 mil
• VIP (via in pad) :
  conductive-conductive copper paste;
  non-conductive-epoxy via hole fill

Applications

Server, Notebook Computer, Cloud Server, Telecommunication Equipment, Computer Camera Accessories, WIFI Base Station, Set-top Box Microconsole, Smartwatch, Disk Storage System, Network Switch, IOT(Internet of Things), Storage Area Network, Gaming Controller, Docking Station, Remote Control, Projector, Monitor and Integrated Touch Panel.