IC Design Application

Technologies

• Any layer HDI
• Aspect ratio up to 25
• Back drill
• Board thickness 10 mm / 390 mil
• Cavity down
• High speed and low loss materials
• Layer count up to 40
• Micro via copper-fill plate
• Minimum line width / spacing 2 mil (50 micro meters)
• Thermal management-coin inserted
• VIP (via in pad) :
  conductive-conductive copper paste ;
  non-conductive-epoxy via hole fill

Applications

Smart Phones, Internet of Things, Multimedia A/V, Telecommunication Equipment, Sensing Component, Smart TV, DVD/Blu-ray Storage System, Smart Audio System, Home Networking Device System, Smart CPU&GPU, Broadband Gateway and Set-top Box, Tablet, LTE Modem Platform, RF Transceiver, NFC( Near Field Communication) Product, Bluetooth Product, GPS (Global Positioning System) Product, Wireless Charging and Wearable Device.