Description

Technologies

●Any layer HDI

●Aspect ratio up to 25

●Back drill

●Board thickness 10 mm / 390 mil

●Cavity down

●High speed and low loss materials

●Layer count up to 40

●Micro via copper-fill plate

●Minimum line width / spacing 2 mil (50 micro meters)

●Thermal management-coin inserted

●VIP (via in pad) :

  conductive-conductive copper paste ;

  non-conductive-epoxy via hole fill

Applications

Smart Phones, Internet of Things, Multimedia A/V, Telecommunication Equipment, Sensing Component, Smart TV, DVD/Blu-ray Storage System, Smart Audio System, Home Networking Device System, Smart CPU&GPU, Broadband Gateway and Set-top Box, Tablet, LTE Modem Platform, RF Transceiver, NFC( Near Field Communication) Product, Bluetooth Product, GPS (Global Positioning System) Product, Wireless Charging and Wearable Device.