Description

Technologies

●Any layer HDI

●Aspect ratio up to 25

●Back drill

●Board thickness 10 mm / 390 mil

●Cavity down

●High speed and low loss materials

●Layer count up to 40

●Micro via copper-fill plate

●Minimum line width / spacing 2 mil

●Thermal management-coin inserted

●VIP (via in pad) :

  conductive-conductive copper paste ;

  non-conductive-epoxy via hole fill

Applications

Optical Fiber Conversion Module, Ethernet Module, Small form Factor Pluggable (SFP) System and Thunderbolt