Description

Technologies

●Any layer HDI

●Aspect ratio up to 25

●Back drill

●Board thickness 10 mm / 390 mil

●Cavity down

●Diversity specialty processes PCB & PCBA

●Heavy-copper products up to 6 oz(210 µm)

●High speed, low loss and multiple material

  combination / RF microwave high performance

  material

●IPC-A-600 class 3 certified products

●Layer count up to 40

●Metal core PCB (aluminum & copper) /

  coin thermal management

●Micro via Cu fill plate

●Minimum line width / spacing 2 mil

●Rigid-flex PCB

●Tightened impedance control tolerance

●VIP (via in pad) :

  conductive-conductive copper paste ;

  non-condective-epoxy via hole fill

Applications

Satellite Antenna, Fiber Optic Broadband, Broadband Central Office, LNB (Low Noise Block Down Converter), VSAT (Very Small Aperture Terminal), Microwave Radio System, RFID Reader System, Communication Base Station Equipment and 4G LTE Device