Description

Technologies

●Aspect ratio up to 25

●Big size board assembly

●Board flatness <0.3%

●Board thickness 9.1 mm

●Embedded component PCB

●High speed and low loss materials

●Layer count up to 40

●Minimum line width / spacing 2 mil

●VIP (via in pad) :

  conductive-conductive copper paste ;

  non-conductive-epoxy via hole fill

Applications

Burn-in, load board and probe Card