Description

Technologies

●Any layer HDI

●Aspect ratio up to 25

●Board thickness range from 10 to 390 mil (0.25 to 9 mm)

●Heavy-copper products up to 6 oz(210 µm)

●High speed, low loss and high performance materials

●Layer count up to 40

●Minimum line width / spacing 2 mil

●Rigid-flex PCB

●Thermal management-coin inserted

●Tightened impedance control tolerance

●VIP (via in pad) :

  conductive- conductive copper paste ;

  non-conductive-epoxy via hole fill

Applications

Surveillance Semiconductor Design System, Smart Home Monitoring System, Smart Drone Camera System, Sports Camera System, Police Wearable Camera System, Consumer Wearable Camera System and Video Imaging System